Here you can explore the product in greater detail

Dicyclopentadiene phenol type resin F646, CAS NO. 30420-31-6, Molecular formula: (C16H18O)n, reddish-brown granular solid, it is a type of resin with a special molecular structure. Its molecular structure contains not only benzene rings but also five-membered and six-membered ring structures. Therefore, the biphenyl-pyridine type ring resin has excellent heat resistance, chemical reaction performance and electrical insulation properties. Thus, it can replace bisphenol A to synthesize epoxy resins with excellent heat resistance, acid and alkali resistance, and anti-friction performance. It can also replace phenolic resins for use in the paint manufacturing industry, and can also be used in the manufacturing of epoxy resin curing agents, printed circuit boards and semiconductor sealing adhesives, etc.

Dicyclopentadiene phenol type resin F646L, CAS NO. 30420-31-6, Molecular formula: (C16H18O)n, reddish-brown granular solid, it is a type of resin with a special molecular structure. Its molecular structure contains not only benzene rings but also five-membered and six-membered ring structures. Therefore, the biphenyl-pyridine type ring resin has excellent heat resistance, chemical reaction performance and electrical insulation properties. Thus, it can replace bisphenol A to synthesize epoxy resins with excellent heat resistance, acid and alkali resistance, and anti-friction performance. It can also replace phenolic resins for use in the paint manufacturing industry, and can also be used in the manufacturing of epoxy resin curing agents, printed circuit boards and semiconductor sealing adhesives, etc.