XY641 Tetramethyl-biphenyl epoxy resin (TMBP Epoxy Resin)
Tetramethyl-biphenyl epoxy resin XY641, white to pale yellow solid with the following characteristics when temperature above its melting point: low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin exhibits outstanding thermal stability and chemical resistance, making it suitable for applications such as epoxy molding compounds (EMC) and high-performance epoxy adhesives.
| 产品牌号 | Melting point | Melt viscosity (at 110℃) | Epoxy equivalent | Total chlorine | Hydrolyzable chloride | Inorganic Chlorine | Na+ | Volatile content |
|---|---|---|---|---|---|---|---|---|
| XY641 | 95 - 115℃ | 35 - 55 mPa.s | 180 - 190 g/eq | ≤ 750 ppm | ≤ 200 ppm | ≤ 5 ppm | ≤ 5 ppm | ≤ 0.3 % |
Paper bags with plastic lining，net weight 20kg，other specifications can be customized accoring to the contract.
① Storage and transportation must comfirm to basic requirements of normal chemicals
② Store in a cool, dry and well ventilated area
Keep away from ignition sources, heat and flame and sunlight
③ It is necessary to maintain insulated (tightly seal) after use, in order to avoid negative influence arousing from moisture absorption
④ The shelf life is one year since production date
