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Tetramethyl-biphenyl epoxy resin XY641, white to pale yellow solid with the following characteristics when temperature above its melting point: low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin exhibits outstanding thermal stability and chemical resistance, making it suitable for applications such as epoxy molding compounds (EMC) and high-performance epoxy adhesives.

Biphenyl Novolac Epoxy Resin XY642, Yellow granular solid with excellent heat resistance, low moisture absorption, flame retardancy, high toughness, good adhesion, and low dielectric constant. The cured resin shows good dimensional stability and chemical stability. Low halogen content. It can be used in epoxy molding compound (EMC), copper clad laminate, flexible circuit board, anti-etching ink, solder mask ink and other fields.

Dicyclopentadiene Phenol Epoxy Resin XY646M, with Benzene rings and five-membered rings and six-membered rings, special molecular structure has the following characteristics when temperature above its melting point: good fluidity, low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin has good heat resistance and chemical stability, wildely used in copper-clad laminates (CCL), FPC flexible boards, epoxy molding compounds (EMC), and powder coatings.

Dicyclopentadiene Phenol Epoxy Resin XY646L, with Benzene rings and five-membered rings and six-membered rings, special molecular structure has the following characteristics when temperature above its melting point: good fluidity, low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin has good heat resistance and chemical stability, wildely used in copper-clad laminates (CCL), FPC flexible boards, epoxy molding compounds (EMC), and powder coatings.

Dicyclopentadiene Phenol Epoxy Resin XY646L,with Benzene rings and five-membered rings and six-membered rings, special molecular structure has the following characteristics when temperature above its melting point: good fluidity, low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin has good heat resistance and chemical stability, wildely used in copper-clad laminates (CCL), FPC flexible boards, epoxy molding compounds (EMC), and powder coatings.

2,2 '- dimethyl-5,5' - di-tert-butyl diphenyl sulfide epoxy resin XY650,White to pale yellow solid with with excellent heat resistance, moisture resistance, and adhesion for cured products. At temperatures above the melting point, it has low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high TG, high bonding strength, excellent heat resistance, and excellent chemical stability. The cured resin has excellent heat resistance and chemical stability, and is suitable for applications such as IC packaging, molding materials, high-performance epoxy adhesives, and powder coatings.

Triglycidyl p-aminophenol XY530L,Pale yellow transparent liquid, with low total chlorine content, multifunctionality, excellent reactivity, strong adhesion properties.The cured product exhibits high crosslinking density, low shrinkage, and outstanding mechanical performance, heat resistance, and corrosion resistance.

4,4'-Methylenebis(N,N-diglycidylaniline) XY570L, Amber to brownish-yellow transparent liquid with excellent adhesion, heat resistance, electrical insulation and chemical resistance.The low resin viscosity offers good processing performance, the cured resin shows good heat resistance and chemical stability and high modulus, can be used in high-temperature composite materials, high-temperature adhesives, copper clad laminates (with UV-blocking properties).

N,N-di(glycidyl)-o-toluidin XY542,Its molecular structure simultaneously contains epoxy groups and aromatic amine groups. Without sacrificing the final performance of the cured product, it significantly improves the processing performance of epoxy resin during the manufacturing process.

1,6-Dihydroxynaphthol epoxy resin XY643,Light yellow liquid. When left at room temperature, it crystallizes into a white solid. The product contains a large planar naphthalene ring structure. After curing, the system has good heat resistance, low water absorption rate, low thermal expansion coefficient, high bonding strength, excellent heat resistance and chemical resistance. It can be applied in fields such as composite materials, electronic packaging materials, high-performance epoxy adhesives, and powder coatings.

Naphthol epoxy resin XY676, Brown solid, The product contains a large planar naphthalene ring structure. After curing, the system has excellent heat resistance, low water absorption rate, low thermal expansion coefficient, high bonding strength, good heat resistance and chemical resistance, and can be applied in fields such as composite materials, electronic packaging materials, high-performance epoxy adhesives, and powder coatings.

Bisphenol A type epoxy resin XY128L,colorless or light yellow liquid, with low internal stress, low hygroscopicity, low dielectric constant, high bonding strength, excellent heat resistance and chemical resistance. After curing, the resin can be applied in fields such as IC packaging, molding materials, high-performance epoxy adhesives, etc.