XY646L Dicyclopentadiene Phenol Epoxy Resin
Dicyclopentadiene Phenol Epoxy Resin XY646L, CAS NO. 119345-05-0, Molecular formula: C22H28O4, with Benzene rings and five-membered rings and six-membered rings, special molecular structure has the following characteristics when temperature above its melting point: good fluidity, low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin has good heat resistance and chemical stability, wildely used in copper-clad laminates (CCL), FPC flexible boards, epoxy molding compounds (EMC), and powder coatings.
| 产品牌号 | Soft point | Melt viscosity (at 150℃) | Epoxy equivalent | Total chlorine | Hydrolyzable chloride | Inorganic Chlorine | Volatile content |
|---|---|---|---|---|---|---|---|
| XY646L | 50- 60℃ | 10 - 200 mPa.s | 220 - 250 g/eq | ≤ 900 ppm | ≤ 200 ppm | ≤ 10 ppm | ≤ 0.3 % |
Kraft paper bags with three layer，net weight 25kg，other specifications can be customized accoring to the contract.
