XY650 2,2 '- dimethyl-5,5' - di-tert-butyl diphenyl sulfide epoxy resin
2,2 '- dimethyl-5,5' - di-tert-butyl diphenyl sulfide epoxy resin XY650, CAS NO. 170577-61-4, Molecular formula: C28H38O4S, White to pale yellow solid with with excellent heat resistance, moisture resistance, and adhesion for cured products. At temperatures above the melting point, it has low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high TG, high bonding strength, excellent heat resistance, and excellent chemical stability. The cured resin has excellent heat resistance and chemical stability, and is suitable for applications such as IC packaging, molding materials, high-performance epoxy adhesives, and powder coatings.
| 产品牌号 | Soft point | Melt viscosity (at 120℃) | Epoxy equivalent | Total chlorine | Hydrolyzable chloride | Inorganic Chlorine | Na+ | Volatile content |
|---|---|---|---|---|---|---|---|---|
| XY650 | 113- 126℃ | 30 - 70 mPa.s | 240 - 255 g/eq | ≤ 750 ppm | ≤ 200 ppm | ≤ 10 ppm | ≤ 5 ppm | ≤ 0.4 % |
Paper bags with plastic lining，net weight 20kg，other specifications can be customized accoring to the contract.
