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Dicyclopentadiene Phenol Epoxy Resin XY646M, with Benzene rings and five-membered rings and six-membered rings, special molecular structure has the following characteristics when temperature above its melting point: good fluidity, low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin has good heat resistance and chemical stability, wildely used in copper-clad laminates (CCL), FPC flexible boards, epoxy molding compounds (EMC), and powder coatings.

Dicyclopentadiene Phenol Epoxy Resin XY646L, with Benzene rings and five-membered rings and six-membered rings, special molecular structure has the following characteristics when temperature above its melting point: good fluidity, low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin has good heat resistance and chemical stability, wildely used in copper-clad laminates (CCL), FPC flexible boards, epoxy molding compounds (EMC), and powder coatings.

Dicyclopentadiene Phenol Epoxy Resin XY646L,with Benzene rings and five-membered rings and six-membered rings, special molecular structure has the following characteristics when temperature above its melting point: good fluidity, low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin has good heat resistance and chemical stability, wildely used in copper-clad laminates (CCL), FPC flexible boards, epoxy molding compounds (EMC), and powder coatings.