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Tetramethyl-biphenyl epoxy resin (TMBP Epoxy Resin)

Biphenyl Novolac Epoxy Resin

Dicyclopentadiene Phenol Epoxy Resin

2,2 '- dimethyl-5,5' - di-tert-butyl diphenyl sulfide epoxy resin

Triglycidyl p-aminophenol

4,4'-Methylenebis(N,N-diglycidylaniline)

N,N-di(glycidyl)-o-toluidin

1,6-Dihydroxynaphthol epoxy resin

Naphthol epoxy resin

High purity low total chlorine bisphenol A epoxy resin

Low chlorine non-crystallizing bisphenol A epoxy resin

High purity low total chlorine bisphenol F type epoxy resin

Dicyclopentadiene phenol type resin

Linear Phenolic Resin

Solvent-base Linear Phenolic Resin

Toughening modified epoxy resin

XY676 Naphthol epoxy resin

Naphthol epoxy resin XY676, Brown solid, The product contains a large planar naphthalene ring structure. After curing, the system has excellent heat resistance, low water absorption rate, low thermal expansion coefficient, high bonding strength, good heat resistance and chemical resistance, and can be applied in fields such as composite materials, electronic packaging materials, high-performance epoxy adhesives, and powder coatings.

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