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Tetramethyl-biphenyl epoxy resin (TMBP Epoxy Resin)

Biphenyl Novolac Epoxy Resin

Dicyclopentadiene Phenol Epoxy Resin

2,2 '- dimethyl-5,5' - di-tert-butyl diphenyl sulfide epoxy resin

Triglycidyl p-aminophenol

4,4'-Methylenebis(N,N-diglycidylaniline)

N,N-di(glycidyl)-o-toluidin

1,6-Dihydroxynaphthol epoxy resin

Naphthol epoxy resin

High purity low total chlorine bisphenol A epoxy resin

Low chlorine non-crystallizing bisphenol A epoxy resin

High purity low total chlorine bisphenol F type epoxy resin

Dicyclopentadiene phenol type resin

Linear Phenolic Resin

Solvent-base Linear Phenolic Resin

Toughening modified epoxy resin

XY128K Low chlorine non-crystallizing bisphenol A epoxy resin

Bisphenol A type epoxy resin XY128K, colorless or light yellow liquid, with low viscosity, low internal stress, low water absorption, low dielectric constant, high bonding strength, excellent heat resistance and chemical resistance. After curing, the resin can be applied in fields such as IC packaging, molding materials, and high-performance epoxy adhesives.

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