Product Center

Here you can explore the product in greater detail

Reactive Diluent Division

Acetal Division

Epoxy Resin Division

Electronic Material Division

By Category

Special electronic materials

Tetramethyl-biphenyl epoxy resin (TMBP Epoxy Resin)

Biphenyl Novolac Epoxy Resin

Dicyclopentadiene Phenol Epoxy Resin

2,2 '- dimethyl-5,5' - di-tert-butyl diphenyl sulfide epoxy resin

Triglycidyl p-aminophenol

4,4'-Methylenebis(N,N-diglycidylaniline)

N,N-di(glycidyl)-o-toluidin

1,6-Dihydroxynaphthol epoxy resin

Naphthol epoxy resin

High purity low total chlorine bisphenol A epoxy resin

Low chlorine non-crystallizing bisphenol A epoxy resin

High purity low total chlorine bisphenol F type epoxy resin

Dicyclopentadiene phenol type resin

Linear Phenolic Resin

Solvent-base Linear Phenolic Resin

Toughening modified epoxy resin

XY170L High purity low total chlorine bisphenol F type epoxy resin

Bisphenol A type epoxy resin XY170L,colorless or light yellow liquid, with low internal stress, low hygroscopicity, low dielectric constant, high bonding strength, excellent heat resistance and chemical resistance. After curing, the resin can be applied in fields such as IC packaging, molding materials, high-performance epoxy adhesives, etc.

Learn More

Go to