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Linear Phenolic Resin F820,Colorless to pale yellow transparent granular solid, with narrow molecular weight distribution, low content of free phenols and impurity ions, which can provide excellent heat resistance and stable mechanical properties for copper-clad boards. In terms of application, linear phenolic resin is a key material in the electronics field, used for manufacturing printed circuit board substrates and semiconductor packaging materials; in the field of friction materials, it is used as a bonding agent for brake pads and clutch face sheets; it is also used to produce molding plastics, and to manufacture insulating components such as electrical switches and sockets. It can also be used as a collective resin for coatings and adhesives, and is widely applied in scenarios such as metal corrosion prevention and wood bonding.