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Tetramethyl-biphenyl epoxy resin (TMBP Epoxy Resin)

Biphenyl Novolac Epoxy Resin

Dicyclopentadiene Phenol Epoxy Resin

2,2 '- dimethyl-5,5' - di-tert-butyl diphenyl sulfide epoxy resin

Triglycidyl p-aminophenol

4,4'-Methylenebis(N,N-diglycidylaniline)

N,N-di(glycidyl)-o-toluidin

1,6-Dihydroxynaphthol epoxy resin

Naphthol epoxy resin

High purity low total chlorine bisphenol A epoxy resin

Low chlorine non-crystallizing bisphenol A epoxy resin

High purity low total chlorine bisphenol F type epoxy resin

Dicyclopentadiene phenol type resin

Linear Phenolic Resin

Solvent-base Linear Phenolic Resin

Toughening modified epoxy resin

XY641 Tetramethyl-biphenyl epoxy resin (TMBP Epoxy Resin)

Tetramethyl-biphenyl epoxy resin XY641, white to pale yellow solid with the following characteristics when temperature above its melting point: low viscosity, low internal stress, low moisture absorption, low dielectric constant, good fluidity, high Tg, high bonding strength, excellent heat and chemical resistance. The cured resin exhibits outstanding thermal stability and chemical resistance, making it suitable for applications such as epoxy molding compounds (EMC) and high-performance epoxy adhesives.

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